Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PZU884LS-C8V2-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PZU884LS-C8V2-QSOD882BDDFN1006-20.911480 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667043315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.584237
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.218249
Phenolic resinProprietary0.00257113.5300000.282036
subTotal0.019000100.0000002.084522
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000005.485584
subTotal0.050000100.0000005.485584
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.429324
Magnesium (Mg)7439-95-40.0005920.1500000.065004
Nickel (Ni)7440-02-00.0117712.9800001.291416
Silicon (Si)7440-21-30.0025680.6500000.281685
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004334
Nickel (Ni)7440-02-00.0022520.5700000.247016
Palladium (Pd)7440-05-30.0001580.0400000.017334
subTotal0.395000100.00000043.336113
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.703362
Silica fused60676-86-00.33878980.09200037.169127
PigmentCarbon black1333-86-40.0039250.9280000.430667
PolymerEpoxy resin systemProprietary0.0357448.4500003.921479
Phenolic resinProprietary0.0107862.5500001.183405
subTotal0.423000100.00000046.408040
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000099
Non hazardousProprietary0.0000110.0555000.001218
Tin solderTin (Sn)7440-31-50.01998899.9400002.192917
subTotal0.020000100.0000002.194234
WireImpurityNon hazardousProprietary0.0000000.0100000.000049
Pure metalGold (Au)7440-57-50.00448099.9900000.491459
subTotal0.004480100.0000000.491508
total0.911480100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.