74ALVCH16374
2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state
The 74ALVCH16374 is a 16-bit edge-triggered D-type flip-flop with bus hold inputs and 3-state outputs. The device can be used as two 8-bit flip-flops or one 16-bit flip-flop. The device features two clocks (1CP and 2CP) and two output enables (1OE and 2OE), each controlling 8-bits. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (nCP) transition. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Operation of the nOE input does not affect the state of the flip-flops.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power dissipation
MULTIBYTE™ flow-through standard pin-out architecture
Low inductance multiple VCC and GND pins for minimum noise and ground bounce
Direct interface with TTL levels
All data inputs have bus hold
Latch-up performance exceeds 100 mA per JESD 78 Class II.A
Output drive capability 50 Ω transmission lines at 85 °C
IOFF circuitry provides partial Power-down mode operation
Current drive ±24 mA at VCC = 3.0 V
-
Complies with JEDEC standards:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C/JESD36 (2.7 V to 3.6 V)
-
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74ALVCH16374DGG | 1.2 - 3.6 | TTL | ± 24 | 2.3 | 350 | low | -40~85 | TSSOP48 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74ALVCH16374DGG | 74ALVCH16374DGG:11 (935205130118) |
Active | ALVCH16374 |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT362-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74ALVCH16374DL | 74ALVCH16374DL,112 (935260444112) |
Obsolete | ALVCH16374 Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74ALVCH16374DL,118 (935260444118) |
Obsolete | ALVCH16374 Standard Procedure Standard Procedure | SOT370-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74ALVCH16374DGG | 74ALVCH16374DGG:11 | 74ALVCH16374DGG |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74ALVCH16374DL | 74ALVCH16374DL,112 | 74ALVCH16374DL |
|
|
| 74ALVCH16374DL | 74ALVCH16374DL,118 | 74ALVCH16374DL |
|
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Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| 74ALVCH16374 | 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state | Data sheet | 2024-06-19 |
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16374 | alvch16374 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
| SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16374 | alvch16374 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
Sample
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