74AUP1G74
Low-power D-type flip-flop with set and reset; positive-edge trigger
The 74AUP1G74 is a single positive edge triggered D-type flip-flop with individual data (D), clock (CP), set (SD) and reset (RD) inputs, and complementary Q and Q outputs. Data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Overvoltage tolerant inputs to 3.6 V
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74AUP1G74DC | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | VSSOP8 |
74AUP1G74GN | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | XSON8 |
74AUP1G74GS | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | XSON8 |
74AUP1G74GT | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | XSON8 |
74AUP1G74GX | 0.8 - 3.6 | CMOS | ± 1.9 | 9.2 | 400 | ultra low | -40~125 | X2SON8 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP1G74DC | 74AUP1G74DC,125 (935280717125) |
Active | p74 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
74AUP1G74GN | 74AUP1G74GN,115 (935292215115) |
Active | 54 |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
74AUP1G74GS | 74AUP1G74GS,115 (935292775115) |
Active | 54 |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74AUP1G74GT | 74AUP1G74GT,115 (935280718115) |
Active | p74 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
74AUP1G74GX | 74AUP1G74GXX (935308441115) |
Active | 54 |
X2SON8 (SOT1233-2) |
SOT1233-2 | SOT1233-2_115 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP1G74GD | 74AUP1G74GD,125 (935286839125) |
Obsolete | p74 |
XSON8 (SOT996-2) |
SOT996-2 | SOT996-2_125 | |
74AUP1G74GF | 74AUP1G74GF,115 (935291471115) |
Obsolete | no package information | ||||
74AUP1G74GM | 74AUP1G74GM,125 (935281287125) |
Obsolete | p74 | no package information |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP1G74DC | 74AUP1G74DC,125 | 74AUP1G74DC | ||
74AUP1G74GN | 74AUP1G74GN,115 | 74AUP1G74GN | ||
74AUP1G74GS | 74AUP1G74GS,115 | 74AUP1G74GS | ||
74AUP1G74GT | 74AUP1G74GT,115 | 74AUP1G74GT | ||
74AUP1G74GX | 74AUP1G74GXX | 74AUP1G74GX |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP1G74GD | 74AUP1G74GD,125 | 74AUP1G74GD | ||
74AUP1G74GF | 74AUP1G74GF,115 | 74AUP1G74GF | ||
74AUP1G74GM | 74AUP1G74GM,125 | 74AUP1G74GM |
Documentation (28)
File name | Title | Type | Date |
---|---|---|---|
74AUP1G74 | Low-power D-type flip-flop with set and reset; positive-edge trigger | Data sheet | 2024-08-09 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
001aae087 | Block diagram: 74AUP1G74DC, 74AUP1G74GD, 74AUP1G74GM, 74AUP1G74GT | Block diagram | 2009-11-04 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
aup1g74 | aup1g74 IBIS model | IBIS model | 2013-04-07 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
aup1g74 | aup1g74 IBIS model | IBIS model | 2013-04-07 |
Ordering, pricing & availability
Sample
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