74LV132-Q100
Quad 2-input NAND Schmitt trigger
The 74LV132-Q100 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC132-Q100 and 74HCT132-Q100.
The 74LV132-Q100 contains four 2-input NAND gates which accept standard input signals. These gates are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
The gate switches at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide operating voltage: 1.0 V to 5.5 V
Optimized for low voltage applications: 1.0 V to 3.6 V
Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Applications
Wave and pulse shapers for highly noisy environments
Astable multivibrators
Monostable multivibrators
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LV132BQ-Q100 | 1.0 - 5.5 | TTL | ± 12 | 10 | 30 | 4 | low | -40~125 | DHVQFN14 |
74LV132D-Q100 | 1.0 - 5.5 | TTL | ± 12 | 10 | 30 | 4 | low | -40~125 | SO14 |
74LV132PW-Q100 | 1.0 - 5.5 | TTL | ± 12 | 10 | 30 | 4 | low | -40~125 | TSSOP14 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LV132BQ-Q100 | 74LV132BQ-Q100X (935301033115) |
Active | LV132 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74LV132D-Q100 | 74LV132D-Q100J (935301031118) |
Active | 74LV132D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LV132PW-Q100 | 74LV132PW-Q100J (935301032118) |
Active | LV132 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LV132BQ-Q100 | 74LV132BQ-Q100X | 74LV132BQ-Q100 | ||
74LV132D-Q100 | 74LV132D-Q100J | 74LV132D-Q100 | ||
74LV132PW-Q100 | 74LV132PW-Q100J | 74LV132PW-Q100 |
Documentation (18)
File name | Title | Type | Date |
---|---|---|---|
74LV132_Q100 | Quad 2-input NAND Schmitt trigger | Data sheet | 2024-01-30 |
mna407 | Block diagram: 74HC132D, 74HC132DB, 74HC132N, 74HC132PW, 74HCT132D, 74HCT132DB, 74HCT132N, 74HCT132PW, 74AHC132BQ, 74AHC132D, 74AHC132PW, 74AHCT132BQ, 74AHCT132D, 74AHCT132PW, 74LV132BQ, 74LV132D, 74LV132DB, 74LV132N, 74LV132PW | Block diagram | 2009-11-03 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lv | lv Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lv | lv Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
Sample
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