BC69PAS series
20 V, 2 A PNP medium power transistors
PNP medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
NPN complement: BC68PAS series
Features and benefits
High collector current capability IC and ICM
Reduced Printed-Circuit Board (PCB) area requirements
Exposed heat sink for excellent thermal and electrical conductivity
AEC-Q101 qualified
Two current gain selections
Leadless very small SMD plastic package with medium power capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Applications
Linear voltage regulators
Battery driven devices
MOSFET drivers
High-side switches
Power management
Amplifiers
Parametrics
Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) |
---|---|---|---|---|---|---|---|---|---|---|---|
BC69-16PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 100.0 | 250.0 | 150 | 40.0 |
BC69-25PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 160.0 | 375.0 | 150 | 40.0 |
BC69PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 420.0 | -20.0 | -2000.0 | 85.0 | 375.0 | 150 | 40.0 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BC69-16PAS | BC69-16PASX (934068112115) |
Active | C2 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
BC69-25PAS | BC69-25PASX (934068113115) |
Active | C3 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
BC69PAS | BC69PASX (934068111115) |
Active | C1 |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BC69-16PAS | BC69-16PASX | BC69-16PAS | ||
BC69-25PAS | BC69-25PASX | BC69-25PAS | ||
BC69PAS | BC69PASX | BC69PAS |
Documentation (12)
File name | Title | Type | Date |
---|---|---|---|
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
BC69PAS_Nexperia_Product_Quality | BC69PAS Nexperia Product Quality | Quality document | 2019-05-20 |
BC69PAS_Nexperia_Product_Reliability | BC69PAS Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BC69PAS | BC69PAS SPICE model | SPICE model | 2024-04-05 |
Support
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Ordering, pricing & availability
Sample
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