Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 1PS70SB86

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
1PS70SB86SOT323SC-705.663620 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405649111512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000000.706262
subTotal0.040000100.0000000.706262
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0020320.1000000.035878
Carbon (C)7440-44-00.0010160.0500000.017939
Chromium (Cr)7440-47-30.0020320.1000000.035878
Cobalt (Co)7440-48-40.0101600.5000000.179391
Iron (Fe)7439-89-61.05054451.70000018.548985
Manganese (Mn)7439-96-50.0162560.8000000.287025
Nickel (Ni)7440-02-00.81280040.00000014.351245
Phosphorus (P)7723-14-00.0005080.0250000.008970
Silicon (Si)7440-21-30.0060960.3000000.107634
Sulphur (S)7704-34-90.0005080.0250000.008970
Pure metal layerCopper (Cu)7440-50-80.0894084.4000001.578637
Silver (Ag)7440-22-40.0406402.0000000.717562
subTotal2.032000100.00000035.878113
Mould CompoundFillerSilica fused60676-86-02.39270071.00000042.246832
PigmentCarbon black1333-86-40.0101100.3000000.178508
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.66389019.70000011.722008
Phenolic resinProprietary0.3033009.0000005.355232
subTotal3.370000100.00000059.502580
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000111
Bismuth (Bi)7440-69-90.0000020.0010000.000037
Copper (Cu)7440-50-80.0000020.0010000.000037
Lead (Pb)7439-92-10.0000100.0050000.000185
Tin solderTin (Sn)7440-31-50.20997999.9900003.707505
subTotal0.210000100.0000003.707876
WirePure metalGold (Au)7440-57-50.011620100.0000000.205169
subTotal0.011620100.0000000.205169
total5.663620100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.