Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 2N7002NXBK

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
2N7002NXBKSOT23TO-236AB7.666353 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346612822152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.652201
subTotal0.050000100.0000000.652201
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029924
Carbon (C)7440-44-00.0010200.0400000.013300
Chromium (Cr)7440-47-30.0056080.2200000.073148
Cobalt (Co)7440-48-40.0109610.4300000.142972
Iron (Fe)7439-89-61.22301047.98000015.952960
Manganese (Mn)7439-96-50.0219210.8600000.285943
Nickel (Ni)7440-02-00.92120936.14000012.016256
Phosphorus (P)7723-14-00.0005100.0200000.006650
Silicon (Si)7440-21-30.0066270.2600000.086448
Sulphur (S)7704-34-90.0005100.0200000.006650
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.780432
Silver (Ag)7440-22-40.0655092.5700000.854504
subTotal2.549000100.00000033.249186
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.845610
Triphenylphosphine603-35-00.0024400.0500000.031821
FillerSilica -amorphous-7631-86-93.51288072.00000045.822049
PigmentCarbon black1333-86-40.0024400.0500000.031821
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.546260
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.364173
subTotal4.879000100.00000063.641734
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001339
Tin solderTin (Sn)7440-31-50.18488999.9400002.411694
subTotal0.185000100.0000002.413142
WirePure metalCopper (Cu)7440-50-80.003352100.0000000.043730
subTotal0.003352100.0000000.043730
total7.666353100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.