Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHC273BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC273BQSOT764-1DHVQFN2028.026075 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527304911516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003043
FillerSilver (Ag)7440-22-40.06396075.0000000.228216
PolymerAcrylic resinProprietary0.0051176.0000000.018257
Resin systemProprietary0.01535018.0000000.054772
subTotal0.085280100.0000000.304288
DieDoped siliconSilicon (Si)7440-21-30.339085100.0000001.209891
subTotal0.339085100.0000001.209891
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.783244
Iron (Fe)7439-89-60.2607362.4000000.930335
Phosphorus (P)7723-14-00.0032590.0300000.011629
Zinc (Zn)7440-66-60.0108640.1000000.038764
subTotal10.864020100.00000038.763972
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.743474
FillerSilica -amorphous-7631-86-90.5714843.4900002.039117
Silica fused60676-86-013.88919984.82000049.558130
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.585443
PigmentCarbon black1333-86-40.0268550.1640000.095821
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.162398
Epoxy resin systemProprietary0.2597061.5860000.926659
Phenolic resinProprietary0.3689272.2530001.316370
subTotal16.374910100.00000058.427411
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009840
Nickel (Ni)7440-02-00.25095191.0000000.895419
Palladium (Pd)7440-05-30.0220628.0000000.078718
subTotal0.275770100.0000000.983977
WirePure metalCopper (Cu)7440-50-80.08400896.5500000.299750
Pure metal layerGold (Au)7440-57-50.0003050.3500000.001087
Palladium (Pd)7440-05-30.0026973.1000000.009624
subTotal0.087010100.0000000.310461
total28.026075100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.