Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT02BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT02BQSOT762-1DHVQFN1418.147514 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528553911511126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001282
FillerSilver (Ag)7440-22-40.01744575.0000000.096129
PolymerAcrylic resinProprietary0.0013966.0000000.007690
Resin systemProprietary0.00418718.0000000.023071
subTotal0.023260100.0000000.128172
DieDoped siliconSilicon (Si)7440-21-30.398290100.0000002.194737
subTotal0.398290100.0000002.194737
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.487075
Iron (Fe)7439-89-60.1675092.4000000.923043
Phosphorus (P)7723-14-00.0020940.0300000.011538
Zinc (Zn)7440-66-60.0069800.1000000.038460
subTotal6.979555100.00000038.460116
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.729806
FillerSilica -amorphous-7631-86-90.3671483.4900002.023131
Silica fused60676-86-08.92306484.82000049.169622
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.580853
PigmentCarbon black1333-86-40.0172530.1640000.095070
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.145446
Epoxy resin systemProprietary0.1668471.5860000.919394
Phenolic resinProprietary0.2370162.2530001.306050
subTotal10.520000100.00000057.969373
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009763
Nickel (Ni)7440-02-00.16123091.0000000.888442
Palladium (Pd)7440-05-30.0141748.0000000.078105
subTotal0.177176100.0000000.976310
WirePure metalCopper (Cu)7440-50-80.04753496.5500000.261931
Pure metal layerGold (Au)7440-57-50.0001720.3500000.000950
Palladium (Pd)7440-05-30.0015263.1000000.008410
subTotal0.049232100.0000000.271290
total18.147514100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.