Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT1G125GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT1G125GFSOT891XSON61.20459 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855261327126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.05520100.000004.58276
subTotal0.05520100.000004.58276
ComponentAdditiveNon hazardousProprietary0.001505.000000.12452
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99619
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37357
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24905
Resin systemProprietary0.0090030.000000.74714
subTotal0.03000100.000002.49047
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.76838
Magnesium (Mg)7439-95-40.000750.150000.06226
Nickel (Ni)7440-02-00.014552.910001.20788
Silicon (Si)7440-21-30.003150.630000.26150
Pure metal layerGold (Au)7440-57-50.000200.040000.01660
Nickel (Ni)7440-02-00.013802.760001.14562
Palladium (Pd)7440-05-30.000550.110000.04566
subTotal0.50000100.0000041.50790
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.62983
Silica fused60676-86-00.3741064.5000031.05621
Flame retardantMetal hydroxideProprietary0.017403.000001.44447
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24075
PigmentCarbon black1333-86-40.001740.300000.14445
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.05928
Phenolic resinProprietary0.014502.500001.20373
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.37044
subTotal0.58000100.0000048.14916
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.66015
subTotal0.02000100.000001.66032
WireGold alloyGold (Au)7440-57-50.0191999.000001.59317
Palladium (Pd)7440-05-30.000191.000000.01609
subTotal0.01938100.000001.60926
total1.20459100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.