Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AHCT573BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHCT573BQ-Q100SOT764-1DHVQFN2028.452985 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353003181155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.002997
FillerSilver (Ag)7440-22-40.06396075.0000000.224792
PolymerAcrylic resinProprietary0.0051176.0000000.017983
Resin systemProprietary0.01535018.0000000.053950
subTotal0.085280100.0000000.299723
DieDoped siliconSilicon (Si)7440-21-30.419610100.0000001.474748
subTotal0.419610100.0000001.474748
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.49847497.47000036.897620
Iron (Fe)7439-89-60.2585042.4000000.908529
Phosphorus (P)7723-14-00.0032310.0300000.011357
Zinc (Zn)7440-66-60.0107710.1000000.037855
subTotal10.770980100.00000037.855360
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.717316
FillerSilica -amorphous-7631-86-90.5714853.4900002.008523
Silica fused60676-86-013.88920784.82000048.814587
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.576659
PigmentCarbon black1333-86-40.0268550.1640000.094383
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.129955
Epoxy resin systemProprietary0.2597061.5860000.912756
Phenolic resinProprietary0.3689272.2530001.296619
subTotal16.374920100.00000057.550798
Pre-PlatingPure metal layerGold (Au)7440-57-50.0215443.0000000.075716
Nickel (Ni)7440-02-00.66282592.3000002.329544
Palladium (Pd)7440-05-30.0222623.1000000.078240
Silver (Ag)7440-22-40.0114901.6000000.040382
subTotal0.718120100.0000002.523883
WirePure metalCopper (Cu)7440-50-80.08117596.5500000.285295
Pure metal layerGold (Au)7440-57-50.0002940.3500000.001034
Palladium (Pd)7440-05-30.0026063.1000000.009160
subTotal0.084076100.0000000.295490
total28.452985100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.