Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G06GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G06GFSOT891XSON61.20306 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528110713211126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.06291100.000005.22917
subTotal0.06291100.000005.22917
ComponentAdditiveNon hazardousProprietary0.001505.000000.12468
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99746
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37405
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24936
Resin systemProprietary0.0090030.000000.74809
subTotal0.03000100.000002.49364
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.81768
Magnesium (Mg)7439-95-40.000750.150000.06234
Nickel (Ni)7440-02-00.014552.910001.20942
Silicon (Si)7440-21-30.003150.630000.26183
Pure metal layerGold (Au)7440-57-50.000200.040000.01662
Nickel (Ni)7440-02-00.013802.760001.14707
Palladium (Pd)7440-05-30.000550.110000.04572
subTotal0.50000100.0000041.56068
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.64208
Silica fused60676-86-00.3741064.5000031.09571
Flame retardantMetal hydroxideProprietary0.017403.000001.44631
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24105
PigmentCarbon black1333-86-40.001740.300000.14463
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.06063
Phenolic resinProprietary0.014502.500001.20526
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.37473
subTotal0.58000100.0000048.21040
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.66226
subTotal0.02000100.000001.66243
WireGold alloyGold (Au)7440-57-50.0100599.000000.83566
Palladium (Pd)7440-05-30.000101.000000.00844
subTotal0.01016100.000000.84410
total1.20306100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.