Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G09GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G09GNSOT1115X2SON60.870545 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352917191326126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.031455100.0000003.613254
subTotal0.031455100.0000003.613254
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.028718
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.028718
Silica -amorphous-7631-86-90.00250050.0000000.287176
PolymerEpoxy resin systemProprietary0.00150030.0000000.172306
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.057435
subTotal0.005000100.0000000.574353
Lead FrameCopper alloyCopper (Cu)7440-50-80.36386494.51000041.797207
Magnesium (Mg)7439-95-40.0005780.1500000.066338
Nickel (Ni)7440-02-00.0113582.9500001.304642
Silicon (Si)7440-21-30.0024640.6400000.283041
Pure metal layerGold (Au)7440-57-50.0000770.0200000.008845
Nickel (Ni)7440-02-00.0063141.6400000.725293
Palladium (Pd)7440-05-30.0003460.0900000.039803
subTotal0.385000100.00000044.225169
Mould CompoundAdditiveNon hazardousProprietary0.0017840.4100000.204872
FillerSilica -amorphous-7631-86-90.0012620.2900000.144909
Silica fused60676-86-00.37475286.15000043.048033
HardenerPhenolic resinProprietary0.0186624.2900002.143657
PigmentCarbon black1333-86-40.0008260.1900000.094941
PolymerEpoxy resin systemProprietary0.0377148.6700004.332286
subTotal0.435000100.00000049.968698
WireGold alloyGold (Au)7440-57-50.01394999.0000001.602341
Palladium (Pd)7440-05-30.0001411.0000000.016185
subTotal0.014090100.0000001.618526
total0.870545100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.