Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G386GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G386GMSOT886XSON61.950181 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528000613214126030 s123520 s3
93528000611513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.090206100.0000004.625517
subTotal0.090206100.0000004.625517
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.012819
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.012819
Silica -amorphous-7631-86-90.00250050.0000000.128193
PolymerEpoxy resin systemProprietary0.00150030.0000000.076916
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.025639
subTotal0.005000100.0000000.256386
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000037.412794
Magnesium (Mg)7439-95-40.0011580.1500000.059379
Nickel (Ni)7440-02-00.0227742.9500001.167789
Silicon (Si)7440-21-30.0049410.6400000.253351
Pure metal layerGold (Au)7440-57-50.0001540.0200000.007917
Nickel (Ni)7440-02-00.0126611.6400000.649212
Palladium (Pd)7440-05-30.0006950.0900000.035627
subTotal0.772000100.00000039.586069
Mould CompoundAdditiveNon hazardousProprietary0.0043710.4100000.224113
FillerSilica -amorphous-7631-86-90.0030910.2900000.158519
Silica fused60676-86-00.91835986.15000047.090962
HardenerPhenolic resinProprietary0.0457314.2900002.344982
PigmentCarbon black1333-86-40.0020250.1900000.103857
PolymerEpoxy resin systemProprietary0.0924228.6700004.739160
subTotal1.066000100.00000054.661593
WireGold alloyGold (Au)7440-57-50.01680599.0000000.861728
Palladium (Pd)7440-05-30.0001701.0000000.008704
subTotal0.016975100.0000000.870432
total1.950181100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.