Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G885GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G885GNSOT1116X2SON81.176440 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352922161156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050678100.0000004.307700
subTotal0.050678100.0000004.307700
ComponentAdditiveNon hazardousProprietary0.0007005.0000000.059502
FillerBisphenol A-epichlorohydrin resin25068-38-60.0007005.0000000.059502
Silica -amorphous-7631-86-90.00700050.0000000.595015
PolymerEpoxy resin systemProprietary0.00420030.0000000.357009
Phenol Formaldehyde resin (generic)9003-35-40.00140010.0000000.119003
subTotal0.014000100.0000001.190031
Lead FrameCopper alloyCopper (Cu)7440-50-80.47287892.90330040.195658
Magnesium (Mg)7439-95-40.0007380.1449000.062693
Nickel (Ni)7440-02-00.0147472.8972001.253506
Silicon (Si)7440-21-30.0031950.6277000.271581
MetallisationGold (Au)7440-57-50.0002140.0421000.018215
Nickel (Ni)7440-02-00.0165013.2418001.402601
Palladium (Pd)7440-05-30.0007280.1430000.061871
subTotal0.509000100.00000043.266125
Mould CompoundAdditiveNon hazardousProprietary0.0023820.4100000.202484
FillerSilica -amorphous-7631-86-90.0016850.2900000.143220
Silica fused60676-86-00.50053286.15000042.546284
HardenerPhenolic resinProprietary0.0249254.2900002.118672
PigmentCarbon black1333-86-40.0011040.1900000.093834
PolymerEpoxy resin systemProprietary0.0503738.6700004.281791
subTotal0.581000100.00000049.386284
WireGold alloyGold (Au)7440-57-50.02154299.0000001.831152
Palladium (Pd)7440-05-30.0002181.0000000.018496
subTotal0.021760100.0000001.849648
total1.176440100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.