Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G97GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G97GFSOT891XSON61.24288 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528133513210126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.09021100.000007.25782
subTotal0.09021100.000007.25782
ComponentAdditiveNon hazardousProprietary0.001505.000000.12069
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.96550
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.36206
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24137
Resin systemProprietary0.0090030.000000.72412
subTotal0.03000100.000002.41374
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000037.57402
Magnesium (Mg)7439-95-40.000750.150000.06034
Nickel (Ni)7440-02-00.014552.910001.17067
Silicon (Si)7440-21-30.003150.630000.25344
Pure metal layerGold (Au)7440-57-50.000200.040000.01609
Nickel (Ni)7440-02-00.013802.760001.11032
Palladium (Pd)7440-05-30.000550.110000.04425
subTotal0.50000100.0000040.22913
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.33316
Silica fused60676-86-00.3741064.5000030.09945
Flame retardantMetal hydroxideProprietary0.017403.000001.39997
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.23333
PigmentCarbon black1333-86-40.001740.300000.14000
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.02665
Phenolic resinProprietary0.014502.500001.16665
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.26661
subTotal0.58000100.0000046.66582
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.60900
subTotal0.02000100.000001.60917
WireGold alloyGold (Au)7440-57-50.0224499.000001.80575
Palladium (Pd)7440-05-30.000231.000000.01824
subTotal0.02267100.000001.82399
total1.24288100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.