Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AVC4T245BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC4T245BQ-Q100SOT763-1DHVQFN1621.398747 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353011131155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004658
FillerSilver (Ag)7440-22-40.07476075.0000000.349366
PolymerAcrylic resinProprietary0.0059816.0000000.027949
Resin systemProprietary0.01794218.0000000.083848
subTotal0.099680100.0000000.465822
DieDoped siliconSilicon (Si)7440-21-30.321959100.0000001.504571
subTotal0.321959100.0000001.504571
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04341097.47000037.588227
Iron (Fe)7439-89-60.1980532.4000000.925533
Phosphorus (P)7723-14-00.0024760.0300000.011569
Zinc (Zn)7440-66-60.0082520.1000000.038564
subTotal8.252190100.00000038.563893
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.734513
FillerSilica -amorphous-7631-86-90.4341033.4900002.028636
Silica fused60676-86-010.55031084.82000049.303402
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.582433
PigmentCarbon black1333-86-40.0203990.1640000.095328
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.151284
Epoxy resin systemProprietary0.1972741.5860000.921896
Phenolic resinProprietary0.2802392.2530001.309603
subTotal12.438470100.00000058.127095
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009790
Nickel (Ni)7440-02-00.19063691.0000000.890874
Palladium (Pd)7440-05-30.0167598.0000000.078319
subTotal0.209490100.0000000.978983
WirePure metalCopper (Cu)7440-50-80.07430396.5500000.347230
Pure metal layerGold (Au)7440-57-50.0002690.3500000.001259
Palladium (Pd)7440-05-30.0023863.1000000.011149
subTotal0.076958100.0000000.359638
total21.398747100.000000100.000000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.