Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AXP1G97GS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AXP1G97GSSOT1202X2SON60.90231 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353016051254126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.64591
subTotal0.02387100.000002.64591
ComponentAdditiveNon hazardousProprietary0.000505.000000.05541
FillerBisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.000505.000000.05541
Silica -amorphous-7631-86-90.0050050.000000.55413
PolymerEpoxy resin systemProprietary0.0030030.000000.33248
Phenol Formaldehyde resin (generic)9003-35-40.0010010.000000.11083
subTotal0.01000100.000001.10826
Lead FrameCopper alloyChromium (Cr)7440-47-30.000910.240000.10107
Copper (Cu)7440-50-80.3582694.2800039.70520
Tin (Sn)7440-31-50.000910.240000.10107
Zinc (Zn)7440-66-60.000800.210000.08844
Pure metal layerGold (Au)7440-57-50.000190.050000.02106
Nickel (Ni)7440-02-00.018164.780002.01306
Palladium (Pd)7440-05-30.000760.200000.08423
subTotal0.38000100.0000042.11413
Mould CompoundFillerSilica -amorphous-7631-86-90.0900020.000009.97440
Silica fused60676-86-00.2902564.5000032.16744
Flame retardantMetal hydroxideProprietary0.013503.000001.49616
ImpuritySilicon Dioxide (SiO2)14808-60-70.002250.500000.24936
PigmentCarbon black1333-86-40.001350.300000.14962
PolymerPhenol Formaldehyde resin (generic)9003-35-40.009902.200001.09718
Phenolic resinProprietary0.011252.500001.24680
Tetramethylbiphenyl diglycidyl ether85954-11-60.031507.000003.49104
subTotal0.45000100.0000049.87200
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00011
Tin solderTin (Sn)7440-31-50.0200099.990002.21631
subTotal0.02000100.000002.21653
WireGold alloyGold (Au)7440-57-50.0182599.000002.02266
Palladium (Pd)7440-05-30.000181.000000.02043
subTotal0.01844100.000002.04309
total0.90231100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.