Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC02BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC02BQ-Q100SOT762-1DHVQFN1417.938816 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352987191157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001297
FillerSilver (Ag)7440-22-40.01744575.0000000.097247
PolymerAcrylic resinProprietary0.0013966.0000000.007780
Resin systemProprietary0.00418718.0000000.023339
subTotal0.023260100.0000000.129663
DieDoped siliconSilicon (Si)7440-21-30.187332100.0000001.044283
subTotal0.187332100.0000001.044283
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80283197.47000037.922408
Iron (Fe)7439-89-60.1675062.4000000.933762
Phosphorus (P)7723-14-00.0020940.0300000.011672
Zinc (Zn)7440-66-60.0069790.1000000.038907
subTotal6.979410100.00000038.906748
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.749932
FillerSilica -amorphous-7631-86-90.3671483.4900002.046670
Silica fused60676-86-08.92307284.82000049.741702
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.587611
PigmentCarbon black1333-86-40.0172530.1640000.096176
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.170408
Epoxy resin systemProprietary0.1668471.5860000.930091
Phenolic resinProprietary0.2370162.2530001.321246
subTotal10.520010100.00000058.643837
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009877
Nickel (Ni)7440-02-00.16123491.0000000.898798
Palladium (Pd)7440-05-30.0141748.0000000.079015
subTotal0.177180100.0000000.987691
WirePure metalCopper (Cu)7440-50-80.04984396.5500000.277848
Pure metal layerGold (Au)7440-57-50.0001810.3500000.001007
Palladium (Pd)7440-05-30.0016003.1000000.008921
subTotal0.051624100.0000000.287776
total17.938816100.000000100.000000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.