Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC253BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC253BQ-Q100SOT763-1DHVQFN1621.892162 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356913091154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.137035
ImpurityNon hazardousProprietary0.0000200.0395000.000090
PolymerResin systemProprietary0.01997639.9514100.091246
subTotal0.050000100.0000000.228371
DieDoped siliconSilicon (Si)7440-21-30.890771100.0000004.068902
subTotal0.890771100.0000004.068902
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.741804
Iron (Fe)7439-89-60.1980572.4000000.904692
Phosphorus (P)7723-14-00.0024760.0300000.011309
Zinc (Zn)7440-66-60.0082520.1000000.037696
subTotal8.252360100.00000037.695500
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.695418
FillerSilica -amorphous-7631-86-90.4341023.4900001.982912
Silica fused60676-86-010.55030284.82000048.192142
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.569306
PigmentCarbon black1333-86-40.0203990.1640000.093180
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.102796
Epoxy resin systemProprietary0.1972741.5860000.901117
Phenolic resinProprietary0.2802392.2530001.280086
subTotal12.438460100.00000056.816956
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009569
Nickel (Ni)7440-02-00.19062791.0000000.870754
Palladium (Pd)7440-05-30.0167588.0000000.076550
subTotal0.209480100.0000000.956872
WirePure metalCopper (Cu)7440-50-80.04932996.5500000.225327
Pure metal layerGold (Au)7440-57-50.0001790.3500000.000817
Palladium (Pd)7440-05-30.0015843.1000000.007235
subTotal0.051092100.0000000.233379
total21.892162100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.