Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC259BZ

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Type numberPackagePackage descriptionTotal product weight
74HC259BZSOT8016-1DHXQFN166.625952 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356914051154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.01150260.0000000.173590
ImpurityNon hazardousProprietary0.0000080.0395000.000114
PolymerResin systemProprietary0.00765939.9514100.115586
subTotal0.019170100.0000000.289291
DieDoped siliconSilicon (Si)7440-21-30.221207100.0000003.338498
subTotal0.221207100.0000003.338498
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.00220897.00000045.309839
Nickel (Ni)7440-02-00.0928523.0000001.401335
subTotal3.095060100.00000046.711174
Mould CompoundAdditiveNon hazardousProprietary0.0964662.9840001.455875
FillerSilica -amorphous-7631-86-90.1128233.4900001.702749
Silica fused60676-86-02.74202784.82000041.383141
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.0323921.0020000.488869
PigmentCarbon black1333-86-40.0053020.1640000.080015
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1196443.7010001.805694
Epoxy resin systemProprietary0.0512721.5860000.773799
Phenolic resinProprietary0.0728342.2530001.099224
subTotal3.232760100.00000048.789366
Pre-PlatingPure metal layerGold (Au)7440-57-50.0001621.0000000.002442
Nickel (Ni)7440-02-00.01472491.0000000.222214
Palladium (Pd)7440-05-30.0012948.0000000.019535
subTotal0.016180100.0000000.244191
WirePure metalCopper (Cu)7440-50-80.04014096.5500000.605801
Pure metal layerGold (Au)7440-57-50.0001460.3500000.002196
Palladium (Pd)7440-05-30.0012893.1000000.019451
subTotal0.041574100.0000000.627448
total6.625952100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.