Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC373BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC373BQ-Q100SOT764-1DHVQFN2028.371857 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352990341155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003006
FillerSilver (Ag)7440-22-40.06396075.0000000.225435
PolymerAcrylic resinProprietary0.0051176.0000000.018035
Resin systemProprietary0.01535018.0000000.054104
subTotal0.085280100.0000000.300580
DieDoped siliconSilicon (Si)7440-21-30.335205100.0000001.181472
subTotal0.335205100.0000001.181472
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.49847497.47000037.003127
Iron (Fe)7439-89-60.2585042.4000000.911127
Phosphorus (P)7723-14-00.0032310.0300000.011389
Zinc (Zn)7440-66-60.0107710.1000000.037964
subTotal10.770980100.00000037.963606
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.722226
FillerSilica -amorphous-7631-86-90.5714853.4900002.014266
Silica fused60676-86-013.88920784.82000048.954170
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.578308
PigmentCarbon black1333-86-40.0268550.1640000.094653
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.136046
Epoxy resin systemProprietary0.2597061.5860000.915366
Phenolic resinProprietary0.3689272.2530001.300327
subTotal16.374920100.00000057.715362
Pre-PlatingPure metal layerGold (Au)7440-57-50.0215443.0000000.075933
Nickel (Ni)7440-02-00.66282592.3000002.336205
Palladium (Pd)7440-05-30.0222623.1000000.078464
Silver (Ag)7440-22-40.0114901.6000000.040498
subTotal0.718120100.0000002.531100
WirePure metalCopper (Cu)7440-50-80.08433896.5500000.297259
Pure metal layerGold (Au)7440-57-50.0003060.3500000.001078
Palladium (Pd)7440-05-30.0027083.1000000.009544
subTotal0.087352100.0000000.307881
total28.371857100.000000100.000000
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