Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT138BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT138BQ-Q100SOT763-1DHVQFN1621.572893 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352987451155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004621
FillerSilver (Ag)7440-22-40.07476075.0000000.346546
PolymerAcrylic resinProprietary0.0059816.0000000.027724
Resin systemProprietary0.01794218.0000000.083171
subTotal0.099680100.0000000.462061
DieDoped siliconSilicon (Si)7440-21-30.243834100.0000001.130282
subTotal0.243834100.0000001.130282
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.97467497.47000036.966177
Iron (Fe)7439-89-60.1963602.4000000.910217
Phosphorus (P)7723-14-00.0024550.0300000.011378
Zinc (Zn)7440-66-60.0081820.1000000.037926
subTotal8.181670100.00000037.925697
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.720511
FillerSilica -amorphous-7631-86-90.4341033.4900002.012260
Silica fused60676-86-010.55031084.82000048.905403
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.577732
PigmentCarbon black1333-86-40.0203990.1640000.094559
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.133918
Epoxy resin systemProprietary0.1972741.5860000.914454
Phenolic resinProprietary0.2802392.2530001.299032
subTotal12.438470100.00000057.657867
Pre-PlatingPure metal layerGold (Au)7440-57-50.0163653.0000000.075860
Nickel (Ni)7440-02-00.50350692.3000002.333974
Palladium (Pd)7440-05-30.0169113.1000000.078389
Silver (Ag)7440-22-40.0087281.6000000.040459
subTotal0.545510100.0000002.528683
WirePure metalCopper (Cu)7440-50-80.06152996.5500000.285216
Pure metal layerGold (Au)7440-57-50.0002230.3500000.001034
Palladium (Pd)7440-05-30.0019763.1000000.009158
subTotal0.063728100.0000000.295408
total21.572893100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.