Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT4040BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT4040BQSOT763-1DHVQFN1621.755687 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352786531159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.137895
ImpurityNon hazardousProprietary0.0000200.0395000.000091
PolymerResin systemProprietary0.01997639.9514100.091818
subTotal0.050000100.0000000.229804
DieDoped siliconSilicon (Si)7440-21-30.754419100.0000003.467687
subTotal0.754419100.0000003.467687
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.972288
Iron (Fe)7439-89-60.1980572.4000000.910367
Phosphorus (P)7723-14-00.0024760.0300000.011380
Zinc (Zn)7440-66-60.0082520.1000000.037932
subTotal8.252360100.00000037.931967
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.706053
FillerSilica -amorphous-7631-86-90.4341023.4900001.995351
Silica fused60676-86-010.55030284.82000048.494455
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.572877
PigmentCarbon black1333-86-40.0203990.1640000.093764
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.115987
Epoxy resin systemProprietary0.1972741.5860000.906770
Phenolic resinProprietary0.2802392.2530001.288116
subTotal12.438460100.00000057.173373
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009629
Nickel (Ni)7440-02-00.19062791.0000000.876216
Palladium (Pd)7440-05-30.0167588.0000000.077030
subTotal0.209480100.0000000.962875
WirePure metalCopper (Cu)7440-50-80.04921096.5500000.226194
Pure metal layerGold (Au)7440-57-50.0001780.3500000.000820
Palladium (Pd)7440-05-30.0015803.1000000.007263
subTotal0.050968100.0000000.234276
total21.755687100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.