Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT4067BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT4067BQSOT815-1DHVQFN2451.006082 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528470411815126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0012721.0000000.002494
FillerSilver (Ag)7440-22-40.09539275.0000000.187022
PolymerAcrylic resinProprietary0.0076316.0000000.014962
Resin systemProprietary0.02289418.0000000.044885
subTotal0.127190100.0000000.249362
DieDoped siliconSilicon (Si)7440-21-31.193496100.0000002.339909
subTotal1.193496100.0000002.339909
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.07832097.47000037.404009
Iron (Fe)7439-89-60.4697652.4000000.920997
Phosphorus (P)7723-14-00.0058720.0300000.011512
Zinc (Zn)7440-66-60.0195740.1000000.038375
subTotal19.573530100.00000038.374894
Mould CompoundAdditiveNon hazardousProprietary0.8803522.9840001.725974
FillerSilica -amorphous-7631-86-91.0296343.4900002.018650
Silica fused60676-86-025.02394484.82000049.060706
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.2956141.0020000.579566
PigmentCarbon black1333-86-40.0483840.1640000.094859
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.0918843.7010002.140694
Epoxy resin systemProprietary0.4679081.5860000.917358
Phenolic resinProprietary0.6646892.2530001.303157
subTotal29.502410100.00000057.840965
Pre-PlatingPure metal layerGold (Au)7440-57-50.0049691.0000000.009741
Nickel (Ni)7440-02-00.45214391.0000000.886448
Palladium (Pd)7440-05-30.0397498.0000000.077930
subTotal0.496860100.0000000.974119
WirePure metalCopper (Cu)7440-50-80.10871296.5500000.213135
Pure metal layerGold (Au)7440-57-50.0003940.3500000.000773
Palladium (Pd)7440-05-30.0034903.1000000.006843
subTotal0.112596100.0000000.220751
total51.006082100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.