Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV138BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV138BQSOT763-1DHVQFN1621.786523 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528557711512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.137700
ImpurityNon hazardousProprietary0.0000200.0395000.000091
PolymerResin systemProprietary0.01997639.9514100.091688
subTotal0.050000100.0000000.229479
DieDoped siliconSilicon (Si)7440-21-30.784476100.0000003.600740
subTotal0.784476100.0000003.600740
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.919959
Iron (Fe)7439-89-60.1980572.4000000.909079
Phosphorus (P)7723-14-00.0024760.0300000.011363
Zinc (Zn)7440-66-60.0082520.1000000.037878
subTotal8.252360100.00000037.878279
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.703639
FillerSilica -amorphous-7631-86-90.4341023.4900001.992527
Silica fused60676-86-010.55030284.82000048.425817
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.572066
PigmentCarbon black1333-86-40.0203990.1640000.093632
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.112992
Epoxy resin systemProprietary0.1972741.5860000.905486
Phenolic resinProprietary0.2802392.2530001.286293
subTotal12.438460100.00000057.092451
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009615
Nickel (Ni)7440-02-00.19062791.0000000.874976
Palladium (Pd)7440-05-30.0167588.0000000.076921
subTotal0.209480100.0000000.961512
WirePure metalCopper (Cu)7440-50-80.04996296.5500000.229323
Pure metal layerGold (Au)7440-57-50.0001810.3500000.000831
Palladium (Pd)7440-05-30.0016043.1000000.007363
subTotal0.051747100.0000000.237517
total21.786523100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.