Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LV4053BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LV4053BQSOT763-1DHVQFN1621.609016 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528557411512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.03000060.0000000.138831
ImpurityNon hazardousProprietary0.0000200.0395000.000091
PolymerResin systemProprietary0.01997639.9514100.092442
subTotal0.050000100.0000000.231364
DieDoped siliconSilicon (Si)7440-21-30.603948100.0000002.794887
subTotal0.603948100.0000002.794887
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000037.223237
Iron (Fe)7439-89-60.1980572.4000000.916546
Phosphorus (P)7723-14-00.0024760.0300000.011457
Zinc (Zn)7440-66-60.0082520.1000000.038189
subTotal8.252360100.00000038.189430
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.717633
FillerSilica -amorphous-7631-86-90.4341023.4900002.008894
Silica fused60676-86-010.55030284.82000048.823610
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.576766
PigmentCarbon black1333-86-40.0203990.1640000.094401
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.130349
Epoxy resin systemProprietary0.1972741.5860000.912924
Phenolic resinProprietary0.2802392.2530001.296859
subTotal12.438460100.00000057.561436
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009694
Nickel (Ni)7440-02-00.19062791.0000000.882163
Palladium (Pd)7440-05-30.0167588.0000000.077553
subTotal0.209480100.0000000.969410
WirePure metalCopper (Cu)7440-50-80.05287996.5500000.244706
Pure metal layerGold (Au)7440-57-50.0001920.3500000.000887
Palladium (Pd)7440-05-30.0016983.1000000.007857
subTotal0.054768100.0000000.253450
total21.609016100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.