Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC00ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC00ABQ-Q100SOT762-1DHVQFN1418.112420 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353003521154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001284
FillerSilver (Ag)7440-22-40.01744575.0000000.096315
PolymerAcrylic resinProprietary0.0013966.0000000.007705
Resin systemProprietary0.00418718.0000000.023116
subTotal0.023260100.0000000.128420
DieDoped siliconSilicon (Si)7440-21-30.134476100.0000000.742452
subTotal0.134476100.0000000.742452
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.74471097.47000037.238036
Iron (Fe)7439-89-60.1660752.4000000.916911
Phosphorus (P)7723-14-00.0020760.0300000.011461
Zinc (Zn)7440-66-60.0069200.1000000.038205
subTotal6.919780100.00000038.204613
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.733159
FillerSilica -amorphous-7631-86-90.3671483.4900002.027053
Silica fused60676-86-08.92307284.82000049.264938
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054111.0020000.581979
PigmentCarbon black1333-86-40.0172530.1640000.095254
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893463.7010002.149605
Epoxy resin systemProprietary0.1668471.5860000.921177
Phenolic resinProprietary0.2370162.2530001.308582
subTotal10.520010100.00000058.081747
Pre-PlatingPure metal layerGold (Au)7440-57-50.0138423.0000000.076423
Nickel (Ni)7440-02-00.42587292.3000002.351272
Palladium (Pd)7440-05-30.0143033.1000000.078970
Silver (Ag)7440-22-40.0073821.6000000.040759
subTotal0.461400100.0000002.547423
WirePure metalCopper (Cu)7440-50-80.05164896.5500000.285155
Pure metal layerGold (Au)7440-57-50.0001870.3500000.001034
Palladium (Pd)7440-05-30.0016583.1000000.009156
subTotal0.053494100.0000000.295344
total18.112420100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.