Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC138ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC138ABQ-Q100SOT763-1DHVQFN1621.553069 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353014091155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004625
FillerSilver (Ag)7440-22-40.07476075.0000000.346865
PolymerAcrylic resinProprietary0.0059816.0000000.027749
Resin systemProprietary0.01794218.0000000.083248
subTotal0.099680100.0000000.462486
DieDoped siliconSilicon (Si)7440-21-30.223121100.0000001.035216
subTotal0.223121100.0000001.035216
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.97467497.47000037.000177
Iron (Fe)7439-89-60.1963602.4000000.911054
Phosphorus (P)7723-14-00.0024550.0300000.011388
Zinc (Zn)7440-66-60.0081820.1000000.037961
subTotal8.181670100.00000037.960580
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.722093
FillerSilica -amorphous-7631-86-90.4341033.4900002.014110
Silica fused60676-86-010.55031084.82000048.950385
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.578263
PigmentCarbon black1333-86-40.0203990.1640000.094646
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603483.7010002.135880
Epoxy resin systemProprietary0.1972741.5860000.915295
Phenolic resinProprietary0.2802392.2530001.300227
subTotal12.438470100.00000057.710900
Pre-PlatingPure metal layerGold (Au)7440-57-50.0163653.0000000.075930
Nickel (Ni)7440-02-00.50350692.3000002.336121
Palladium (Pd)7440-05-30.0169113.1000000.078461
Silver (Ag)7440-22-40.0087281.6000000.040496
subTotal0.545510100.0000002.531008
WirePure metalCopper (Cu)7440-50-80.06238996.5500000.289467
Pure metal layerGold (Au)7440-57-50.0002260.3500000.001049
Palladium (Pd)7440-05-30.0020033.1000000.009294
subTotal0.064618100.0000000.299811
total21.553069100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.