Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G02GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G02GFSOT891XSON61.20927 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528240313214126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06089100.000005.03540
subTotal0.06089100.000005.03540
ComponentAdditiveNon hazardousProprietary0.001505.000000.12404
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99233
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37213
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24808
Resin systemProprietary0.0090030.000000.74425
subTotal0.03000100.000002.48083
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.61834
Magnesium (Mg)7439-95-40.000750.150000.06202
Nickel (Ni)7440-02-00.014552.910001.20321
Silicon (Si)7440-21-30.003150.630000.26049
Pure metal layerGold (Au)7440-57-50.000200.040000.01654
Nickel (Ni)7440-02-00.013802.760001.14118
Palladium (Pd)7440-05-30.000550.110000.04548
subTotal0.50000100.0000041.34726
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.59256
Silica fused60676-86-00.3741064.5000030.93602
Flame retardantMetal hydroxideProprietary0.017403.000001.43888
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.23981
PigmentCarbon black1333-86-40.001740.300000.14389
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.05518
Phenolic resinProprietary0.014502.500001.19907
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.35740
subTotal0.58000100.0000047.96281
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.65372
subTotal0.02000100.000001.65389
WireGold alloyGold (Au)7440-57-50.0182099.000001.50473
Palladium (Pd)7440-05-30.000181.000000.01520
subTotal0.01838100.000001.51993
total1.20927100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.