Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G125GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G125GMSOT886XSON61.903799 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527720313217126030 s123520 s3
93527720311517126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.049629100.0000002.606840
subTotal0.049629100.0000002.606840
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.013132
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013132
Silica -amorphous-7631-86-90.00250050.0000000.131316
PolymerEpoxy resin systemProprietary0.00150030.0000000.078790
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.026263
subTotal0.005000100.0000000.262633
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.324277
Magnesium (Mg)7439-95-40.0011580.1500000.060826
Nickel (Ni)7440-02-00.0227742.9500001.196240
Silicon (Si)7440-21-30.0049410.6400000.259523
Pure metal layerGold (Au)7440-57-50.0001540.0200000.008110
Nickel (Ni)7440-02-00.0126611.6400000.665028
Palladium (Pd)7440-05-30.0006950.0900000.036495
subTotal0.772000100.00000040.550499
Mould CompoundAdditiveNon hazardousProprietary0.0043660.4100000.229357
FillerSilica -amorphous-7631-86-90.0030880.2900000.162228
Silica fused60676-86-00.91749886.15000048.192982
HardenerPhenolic resinProprietary0.0456884.2900002.399859
PigmentCarbon black1333-86-40.0020240.1900000.106287
PolymerEpoxy resin systemProprietary0.0923368.6700004.850066
subTotal1.065000100.00000055.940779
WireImpurityNon hazardousProprietary0.0000010.0100000.000064
Pure metalCopper (Cu)7440-50-80.01174396.4900000.616816
Pure metal layerGold (Au)7440-57-50.0000610.5000000.003196
Palladium (Pd)7440-05-30.0003653.0000000.019178
subTotal0.012170100.0000000.639253
total1.903799100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.