Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G17GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G17GFSOT891XSON61.19566 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528241513212126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05125100.000004.28595
subTotal0.05125100.000004.28595
ComponentAdditiveNon hazardousProprietary0.001505.000000.12545
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000001.00363
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37636
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.25091
Resin systemProprietary0.0090030.000000.75272
subTotal0.03000100.000002.50907
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000039.05793
Magnesium (Mg)7439-95-40.000750.150000.06273
Nickel (Ni)7440-02-00.014552.910001.21690
Silicon (Si)7440-21-30.003150.630000.26345
Pure metal layerGold (Au)7440-57-50.000200.040000.01673
Nickel (Ni)7440-02-00.013802.760001.15417
Palladium (Pd)7440-05-30.000550.110000.04600
subTotal0.50000100.0000041.81791
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.70175
Silica fused60676-86-00.3741064.5000031.28816
Flame retardantMetal hydroxideProprietary0.017403.000001.45526
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24254
PigmentCarbon black1333-86-40.001740.300000.14553
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.06719
Phenolic resinProprietary0.014502.500001.21272
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.39561
subTotal0.58000100.0000048.50876
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.67255
subTotal0.02000100.000001.67272
WireGold alloyGold (Au)7440-57-50.0142799.000001.19314
Palladium (Pd)7440-05-30.000141.000000.01205
subTotal0.01441100.000001.20519
total1.19566100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.