Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G19GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G19GMSOT886XSON61.897970 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527807913214126030 s123520 s3
93527807911516126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.029375100.0000001.547731
subTotal0.029375100.0000001.547731
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.013172
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013172
Silica -amorphous-7631-86-90.00250050.0000000.131720
PolymerEpoxy resin systemProprietary0.00150030.0000000.079032
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.026344
subTotal0.005000100.0000000.263439
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.441977
Magnesium (Mg)7439-95-40.0011580.1500000.061013
Nickel (Ni)7440-02-00.0227742.9500001.199914
Silicon (Si)7440-21-30.0049410.6400000.260320
Pure metal layerGold (Au)7440-57-50.0001540.0200000.008135
Nickel (Ni)7440-02-00.0126611.6400000.667071
Palladium (Pd)7440-05-30.0006950.0900000.036608
subTotal0.772000100.00000040.675037
Mould CompoundAdditiveNon hazardousProprietary0.0043710.4100000.230278
FillerSilica -amorphous-7631-86-90.0030910.2900000.162879
Silica fused60676-86-00.91835986.15000048.386381
HardenerPhenolic resinProprietary0.0457314.2900002.409490
PigmentCarbon black1333-86-40.0020250.1900000.106714
PolymerEpoxy resin systemProprietary0.0924228.6700004.869529
subTotal1.066000100.00000056.165271
WireGold alloyGold (Au)7440-57-50.02533999.0000001.335061
Palladium (Pd)7440-05-30.0002561.0000000.013485
subTotal0.025595100.0000001.348546
total1.897970100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.