Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G58GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G58GFSOT891XSON61.21840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528242413214126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06710100.000005.50755
subTotal0.06710100.000005.50755
ComponentAdditiveNon hazardousProprietary0.001505.000000.12311
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.98490
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.36934
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24622
Resin systemProprietary0.0090030.000000.73867
subTotal0.03000100.000002.46224
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.32896
Magnesium (Mg)7439-95-40.000750.150000.06156
Nickel (Ni)7440-02-00.014552.910001.19419
Silicon (Si)7440-21-30.003150.630000.25854
Pure metal layerGold (Au)7440-57-50.000200.040000.01641
Nickel (Ni)7440-02-00.013802.760001.13263
Palladium (Pd)7440-05-30.000550.110000.04514
subTotal0.50000100.0000041.03743
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.52068
Silica fused60676-86-00.3741064.5000030.70420
Flame retardantMetal hydroxideProprietary0.017403.000001.42810
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.23802
PigmentCarbon black1333-86-40.001740.300000.14281
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.04728
Phenolic resinProprietary0.014502.500001.19009
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.33224
subTotal0.58000100.0000047.60342
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.64133
subTotal0.02000100.000001.64150
WireGold alloyGold (Au)7440-57-50.0210899.000001.73031
Palladium (Pd)7440-05-30.000211.000000.01748
subTotal0.02130100.000001.74779
total1.21840100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.