Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G97GX

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC1G97GXSOT1255-2X2SON60.739714 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353389831476126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.033552100.0000004.535807
subTotal0.033552100.0000004.535807
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.033797
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.033797
Silica -amorphous-7631-86-90.00250050.0000000.337968
PolymerEpoxy resin systemProprietary0.00150030.0000000.202781
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.067594
subTotal0.005000100.0000000.675937
Lead FrameCopper alloyCopper (Cu)7440-50-80.27407994.51000037.052023
Magnesium (Mg)7439-95-40.0004350.1500000.058807
Nickel (Ni)7440-02-00.0085552.9500001.156528
Silicon (Si)7440-21-30.0018560.6400000.250908
Pure metal layerGold (Au)7440-57-50.0000580.0200000.007841
Nickel (Ni)7440-02-00.0047561.6400000.642951
Palladium (Pd)7440-05-30.0002610.0900000.035284
subTotal0.290000100.00000039.204341
Mould CompoundAdditiveNon hazardousProprietary0.0016320.4100000.220599
FillerSilica -amorphous-7631-86-90.0011540.2900000.156033
Silica fused60676-86-00.34287786.15000046.352644
HardenerPhenolic resinProprietary0.0170744.2900002.308216
PigmentCarbon black1333-86-40.0007560.1900000.102229
PolymerEpoxy resin systemProprietary0.0345078.6700004.664857
subTotal0.398000100.00000053.804579
WireGold alloyGold (Au)7440-57-50.01303099.0000001.761502
Palladium (Pd)7440-05-30.0001321.0000000.017793
subTotal0.013162100.0000001.779295
total0.739714100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.