Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC2G07GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC2G07GFSOT891XSON61.24172 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528243213213126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.09055100.000007.29263
subTotal0.09055100.000007.29263
ComponentAdditiveNon hazardousProprietary0.001505.000000.12080
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.96640
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.36240
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24160
Resin systemProprietary0.0090030.000000.72480
subTotal0.03000100.000002.41600
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000037.60912
Magnesium (Mg)7439-95-40.000750.150000.06040
Nickel (Ni)7440-02-00.014552.910001.17176
Silicon (Si)7440-21-30.003150.630000.25368
Pure metal layerGold (Au)7440-57-50.000200.040000.01611
Nickel (Ni)7440-02-00.013802.760001.11136
Palladium (Pd)7440-05-30.000550.110000.04429
subTotal0.50000100.0000040.26672
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.34188
Silica fused60676-86-00.3741064.5000030.12756
Flame retardantMetal hydroxideProprietary0.017403.000001.40128
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.23355
PigmentCarbon black1333-86-40.001740.300000.14013
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.02761
Phenolic resinProprietary0.014502.500001.16774
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.26966
subTotal0.58000100.0000046.70941
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.61051
subTotal0.02000100.000001.61068
WireGold alloyGold (Au)7440-57-50.0209699.000001.68784
Palladium (Pd)7440-05-30.000211.000000.01705
subTotal0.02117100.000001.70489
total1.24172100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.