Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC373ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC373ABQ-Q100SOT764-1DHVQFN2028.030834 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353013631155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003042
FillerSilver (Ag)7440-22-40.06396075.0000000.228177
PolymerAcrylic resinProprietary0.0051176.0000000.018254
Resin systemProprietary0.01535018.0000000.054763
subTotal0.085280100.0000000.304236
DieDoped siliconSilicon (Si)7440-21-30.344642100.0000001.229510
subTotal0.344642100.0000001.229510
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58895697.47000037.776099
Iron (Fe)7439-89-60.2607312.4000000.930159
Phosphorus (P)7723-14-00.0032590.0300000.011627
Zinc (Zn)7440-66-60.0108640.1000000.038757
subTotal10.863810100.00000038.756642
Mould CompoundAdditiveNon hazardousProprietary0.4886282.9840001.743179
FillerSilica -amorphous-7631-86-90.5714853.4900002.038772
Silica fused60676-86-013.88920784.82000049.549746
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.585344
PigmentCarbon black1333-86-40.0268550.1640000.095805
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060363.7010002.162033
Epoxy resin systemProprietary0.2597061.5860000.926502
Phenolic resinProprietary0.3689272.2530001.316147
subTotal16.374920100.00000058.417527
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009838
Nickel (Ni)7440-02-00.25096091.0000000.895299
Palladium (Pd)7440-05-30.0220628.0000000.078708
subTotal0.275780100.0000000.983845
WirePure metalCopper (Cu)7440-50-80.08342296.5500000.297606
Pure metal layerGold (Au)7440-57-50.0003020.3500000.001079
Palladium (Pd)7440-05-30.0026783.1000000.009555
subTotal0.086402100.0000000.308241
total28.030834100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.