Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVT245BBQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVT245BBQSOT764-1DHVQFN2028.370020 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528560511512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.02400060.0000000.084596
ImpurityNon hazardousProprietary0.0000160.0395000.000056
PolymerResin systemProprietary0.01598139.9514100.056329
subTotal0.040000100.0000000.140981
DieDoped siliconSilicon (Si)7440-21-30.724350100.0000002.553225
subTotal0.724350100.0000002.553225
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.325177
Iron (Fe)7439-89-60.2607362.4000000.919056
Phosphorus (P)7723-14-00.0032590.0300000.011488
Zinc (Zn)7440-66-60.0108640.1000000.038294
subTotal10.864020100.00000038.294016
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.722337
FillerSilica -amorphous-7631-86-90.5714843.4900002.014395
Silica fused60676-86-013.88919984.82000048.957310
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.578345
PigmentCarbon black1333-86-40.0268550.1640000.094659
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.136183
Epoxy resin systemProprietary0.2597061.5860000.915424
Phenolic resinProprietary0.3689272.2530001.300411
subTotal16.374910100.00000057.719064
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009720
Nickel (Ni)7440-02-00.25095191.0000000.884563
Palladium (Pd)7440-05-30.0220628.0000000.077764
subTotal0.275770100.0000000.972047
WirePure metalCopper (Cu)7440-50-80.08783196.5500000.309590
Pure metal layerGold (Au)7440-57-50.0003180.3500000.001122
Palladium (Pd)7440-05-30.0028203.1000000.009940
subTotal0.090969100.0000000.320653
total28.370020100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.