Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS16VY-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS16VY-QSOT363SC-885.478344 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663649115312601235
934663649135312601235
934663649125312601235
934663649165312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.090000100.0000001.642832
subTotal0.090000100.0000001.642832
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0020700.1000000.037785
Carbon (C)7440-44-00.0010350.0500000.018893
Chromium (Cr)7440-47-30.0051750.2500000.094463
Cobalt (Co)7440-48-40.0103500.5000000.188926
Iron (Fe)7439-89-61.14264055.20000020.857398
Manganese (Mn)7439-96-50.0207001.0000000.377851
Nickel (Ni)7440-02-00.86070641.58000015.711062
Phosphorus (P)7723-14-00.0006210.0300000.011336
Silicon (Si)7440-21-30.0062100.3000000.113355
Sulphur (S)7704-34-90.0006210.0300000.011336
Pure metal layerCopper (Cu)7440-50-80.0173880.8400000.317395
Silver (Ag)7440-22-40.0024840.1200000.045342
subTotal2.070000100.00000037.785141
Mould CompoundFillerSilica fused60676-86-02.20794075.10000040.303055
PigmentCarbon black1333-86-40.0088200.3000000.160998
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51450017.5000009.391524
Phenol Formaldehyde resin (generic)9003-35-40.2087407.1000003.810276
subTotal2.940000100.00000053.665852
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000203
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000338
Tin solderTin (Sn)7440-31-50.36996399.9900006.753190
subTotal0.370000100.0000006.753866
WirePure metalCopper (Cu)7440-50-80.008344100.0000000.152309
subTotal0.008344100.0000000.152309
total5.478344100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.