Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS21QB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS21QBSOT8015DFN1110D-31.60244 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346609431473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0045676.000000.28457
PolymerBisphenol-F/Formaldehyde/Epichlorohydrin copolymer9003-36-50.0006310.470000.03920
Phenolic resinProprietary0.0008113.530000.05066
subTotal0.00600100.000000.37443
DieDoped siliconSilicon (Si)7440-21-30.04000100.000002.49619
subTotal0.04000100.000002.49619
Lead FrameCopper alloyCopper (Cu)7440-50-80.7188195.5860044.85701
Magnesium (Mg)7439-95-40.001120.149000.06992
Nickel (Ni) - cas no. 7440-02-07440-02-00.022422.980901.39889
Silicon (Si)7440-21-30.004860.645900.30311
Pure metal layerGold (Au)7440-57-50.000060.007700.00361
Nickel (Ni) - cas no. 7440-02-07440-02-00.004470.594000.27875
Palladium (Pd)7440-05-30.000270.036500.01713
subTotal0.75200100.0000046.92842
Mould CompoundAdditiveMisc. Phosphor compounds (generic)7723-14-00.000740.100000.04649
Non hazardousProprietary0.026823.600001.67370
FillerSilica fused60676-86-00.6556088.0000040.91261
PigmentCarbon black1333-86-40.001490.200000.09298
PolymerPhenolic resinProprietary0.030544.100001.90616
Tetramethylbiphenyl diglycidyl ether85954-11-60.029804.000001.85966
subTotal0.74500100.0000046.49160
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.010000.00036
Bismuth (Bi)7440-69-90.000010.020000.00071
Iron (Fe)7439-89-60.000010.010000.00036
Lead (Pb)7439-92-10.000010.010000.00036
Tin solderTin (Sn)7440-31-50.0569799.950003.55530
subTotal0.05700100.000003.55709
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0024499.990000.15238
subTotal0.00244100.000000.15240
total1.60244100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.