Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS70XY-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS70XY-QSOT363SC-885.661548 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346645261153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000001.413041
subTotal0.080000100.0000001.413041
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0020520.0900000.036245
Carbon (C)7440-44-00.0009120.0400000.016109
Chromium (Cr)7440-47-30.0047880.2100000.084571
Cobalt (Co)7440-48-40.0098040.4300000.173168
Iron (Fe)7439-89-61.08072047.40000019.088772
Manganese (Mn)7439-96-50.0193800.8500000.342309
Nickel (Ni)7440-02-00.81441635.72000014.385041
Phosphorus (P)7723-14-00.0004560.0200000.008054
Silicon (Si)7440-21-30.0059280.2600000.104706
Sulphur (S)7704-34-90.0004560.0200000.008054
Pure metal layerCopper (Cu)7440-50-80.29890813.1100005.279616
Silver (Ag)7440-22-40.0421801.8500000.745026
subTotal2.280000100.00000040.271671
Mould CompoundFillerSilica fused60676-86-02.19292075.10000038.733576
PigmentCarbon black1333-86-40.0087600.3000000.154728
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.025800
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.661896
subTotal2.920000100.00000051.576000
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000196
Bismuth (Bi)7440-69-90.0000040.0010000.000065
Copper (Cu)7440-50-80.0000040.0010000.000065
Lead (Pb)7439-92-10.0000180.0050000.000327
Tin solderTin (Sn)7440-31-50.36996399.9900006.534662
subTotal0.370000100.0000006.535315
WirePure metalCopper (Cu)7440-50-80.011548100.0000000.203964
subTotal0.011548100.0000000.203964
total5.661548100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.