Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT32ALS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT32ALSSOD882BDDFN1006-20.903988 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663990315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01444076.0000001.597366
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00198910.4700000.220058
Phenolic resinProprietary0.00257113.5300000.284373
subTotal0.019000100.0000002.101798
DieDoped siliconSilicon (Si)7440-21-30.038000100.0000004.203596
subTotal0.038000100.0000004.203596
Lead FrameCopper alloyCopper (Cu)7440-50-80.37762095.60000041.772678
Magnesium (Mg)7439-95-40.0005920.1500000.065543
Nickel (Ni)7440-02-00.0117712.9800001.302119
Silicon (Si)7440-21-30.0025680.6500000.284019
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004370
Nickel (Ni)7440-02-00.0022520.5700000.249063
Palladium (Pd)7440-05-30.0001580.0400000.017478
subTotal0.395000100.00000043.695270
Mould CompoundFillerSilica -amorphous-7631-86-90.0337557.9800003.734054
Silica fused60676-86-00.33878980.09200037.477174
PigmentCarbon black1333-86-40.0039250.9280000.434236
PolymerEpoxy resin systemProprietary0.0357448.4500003.953979
Phenolic resinProprietary0.0107862.5500001.193213
subTotal0.423000100.00000046.792657
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000100
Non hazardousProprietary0.0000110.0555000.001228
Tin solderTin (Sn)7440-31-50.01998899.9400002.211091
subTotal0.020000100.0000002.212419
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00448099.9900000.495532
subTotal0.004480100.0000000.495582
WireImpurityNon hazardousProprietary0.0000000.0100000.000050
Pure metalGold (Au)7440-57-50.00450899.9900000.498629
subTotal0.004508100.0000000.498679
total0.903988100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.