Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT721-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT721-QSOT23TO-236AB7.691550 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346661402151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000000.780077
subTotal0.060000100.0000000.780077
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029826
Carbon (C)7440-44-00.0010200.0400000.013256
Chromium (Cr)7440-47-30.0056080.2200000.072909
Cobalt (Co)7440-48-40.0109610.4300000.142503
Iron (Fe)7439-89-61.22301047.98000015.900699
Manganese (Mn)7439-96-50.0219210.8600000.285006
Nickel (Ni)7440-02-00.92120936.14000011.976892
Phosphorus (P)7723-14-00.0005100.0200000.006628
Silicon (Si)7440-21-30.0066270.2600000.086165
Sulphur (S)7704-34-90.0005100.0200000.006628
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.768048
Silver (Ag)7440-22-40.0655092.5700000.851705
subTotal2.549000100.00000033.140264
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.839564
Triphenylphosphine603-35-00.0024400.0500000.031717
FillerSilica -amorphous-7631-86-93.51288072.00000045.671939
PigmentCarbon black1333-86-40.0024400.0500000.031717
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.514987
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.343325
subTotal4.879000100.00000063.433248
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000108
Non hazardousProprietary0.0001030.0555000.001335
Tin solderTin (Sn)7440-31-50.18488999.9400002.403794
subTotal0.185000100.0000002.405237
WireImpurityNon hazardousProprietary0.0000020.0100000.000024
Pure metalCopper (Cu)7440-50-80.01854899.9900000.241150
subTotal0.018550100.0000000.241174
total7.691550100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.