Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT854W-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT854W-QSOT323SC-705.463092 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346645101151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.915233
subTotal0.050000100.0000000.915233
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016200.0900000.029654
Carbon (C)7440-44-00.0007200.0400000.013179
Chromium (Cr)7440-47-30.0037800.2100000.069192
Cobalt (Co)7440-48-40.0075600.4200000.138383
Iron (Fe)7439-89-60.84906047.17000015.541748
Manganese (Mn)7439-96-50.0153000.8500000.280061
Nickel (Ni)7440-02-00.63972035.54000011.709852
Phosphorus (P)7723-14-00.0003600.0200000.006590
Silicon (Si)7440-21-30.0045000.2500000.082371
Sulphur (S)7704-34-90.0003600.0200000.006590
Pure metal layerCopper (Cu)7440-50-80.23490013.0500004.299763
Silver (Ag)7440-22-40.0421202.3400000.770992
subTotal1.800000100.00000032.948374
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.739099
PigmentCarbon black1333-86-40.0102000.3000000.186707
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.891268
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.418743
subTotal3.400000100.00000062.235818
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000192
Tin solderTin (Sn)7440-31-50.20997999.9900003.843593
subTotal0.210000100.0000003.843977
WirePure metalCopper (Cu)7440-50-80.003092100.0000000.056593
subTotal0.003092100.0000000.056593
total5.463092100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.