Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAW56S

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAW56SSOT363SC-885.493373 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93404573013512126030 s123520 s3
93404573011511126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.120000100.0000002.184450
subTotal0.120000100.0000002.184450
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.033914
Carbon (C)7440-44-00.0008280.0400000.015073
Chromium (Cr)7440-47-30.0043470.2100000.079132
Cobalt (Co)7440-48-40.0089010.4300000.162032
Iron (Fe)7439-89-60.98118047.40000017.861157
Manganese (Mn)7439-96-50.0175950.8500000.320295
Nickel (Ni)7440-02-00.73919735.71000013.456159
Phosphorus (P)7723-14-00.0004140.0200000.007536
Silicon (Si)7440-21-30.0053820.2600000.097973
Sulphur (S)7704-34-90.0004140.0200000.007536
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.940080
Silver (Ag)7440-22-40.0385021.8600000.700881
subTotal2.070000100.00000037.681767
Mould CompoundFillerSilica fused60676-86-02.19292075.10000039.919372
PigmentCarbon black1333-86-40.0087600.3000000.159465
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.302117
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.774002
subTotal2.920000100.00000053.154956
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000202
Bismuth (Bi)7440-69-90.0000040.0010000.000067
Copper (Cu)7440-50-80.0000040.0010000.000067
Lead (Pb)7439-92-10.0000180.0050000.000337
Tin solderTin (Sn)7440-31-50.36996399.9900006.734715
subTotal0.370000100.0000006.735388
WirePure metalCopper (Cu)7440-50-80.013373100.0000000.243434
subTotal0.013373100.0000000.243434
total5.493373100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.