Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC53PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC53PAS-QSOT1061DHUSON37.554000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346657001151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.164946
PolymerAcrylic resinProprietary0.02200020.0000000.291236
subTotal0.110000100.0000001.456182
DieDoped siliconSilicon (Si)7440-21-30.200000100.0000002.647604
subTotal0.200000100.0000002.647604
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.832851
Magnesium (Mg)7439-95-40.0140200.5000000.185597
Nickel (Ni)7440-02-00.1037483.7000001.373418
Silicon (Si)7440-21-30.0224320.8000000.296955
Pure metal layerGold (Au)7440-57-50.0016820.0600000.022272
Nickel (Ni)7440-02-00.0280401.0000000.371194
Palladium (Pd)7440-05-30.0028040.1000000.037119
subTotal2.804000100.00000037.119407
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.231215
FillerSilica -amorphous-7631-86-90.0123540.2900000.163542
Silica fused60676-86-03.66999086.15000048.583400
HardenerPhenolic resinProprietary0.1827544.2900002.419301
PigmentCarbon black1333-86-40.0080940.1900000.107149
PolymerEpoxy resin systemProprietary0.3693428.6700004.889357
subTotal4.260000100.00000056.393963
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000101
Non hazardousProprietary0.0000940.0555000.001249
Tin solderTin (Sn)7440-31-50.16989899.9400002.249113
subTotal0.170000100.0000002.250463
WireImpurityNon hazardousProprietary0.0000010.0100000.000013
Pure metalCopper (Cu)7440-50-80.00999999.9900000.132367
subTotal0.010000100.0000000.132380
total7.554000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.