Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC56PAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC56PASSOT1061DHUSON37.484000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340681311153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.175842
PolymerAcrylic resinProprietary0.02200020.0000000.293960
subTotal0.110000100.0000001.469802
DieDoped siliconSilicon (Si)7440-21-30.130000100.0000001.737039
subTotal0.130000100.0000001.737039
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000035.158653
Magnesium (Mg)7439-95-40.0140200.5000000.187333
Nickel (Ni)7440-02-00.1037483.7000001.386264
Silicon (Si)7440-21-30.0224320.8000000.299733
Pure metal layerGold (Au)7440-57-50.0016820.0600000.022480
Nickel (Ni)7440-02-00.0280401.0000000.374666
Palladium (Pd)7440-05-30.0028040.1000000.037467
subTotal2.804000100.00000037.466595
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.233378
FillerSilica -amorphous-7631-86-90.0123540.2900000.165072
Silica fused60676-86-03.66999086.15000049.037814
HardenerPhenolic resinProprietary0.1827544.2900002.441929
PigmentCarbon black1333-86-40.0080940.1900000.108151
PolymerEpoxy resin systemProprietary0.3693428.6700004.935088
subTotal4.260000100.00000056.921432
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000102
Non hazardousProprietary0.0000940.0555000.001261
Tin solderTin (Sn)7440-31-50.16989899.9400002.270150
subTotal0.170000100.0000002.271513
WireImpurityNon hazardousProprietary0.0000010.0100000.000013
Pure metalCopper (Cu)7440-50-80.00999999.9900000.133605
subTotal0.010000100.0000000.133618
total7.484000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.