Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC847CMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC847CMBSOT883BXQFN30.679954 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065887315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.335317
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.046194
Phenolic resinProprietary0.00040613.5300000.059695
subTotal0.003000100.0000000.441206
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000004.412063
subTotal0.030000100.0000004.412063
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.098830
Copper (Cu)7440-50-80.26320094.00000038.708501
Tin (Sn)7440-31-50.0006720.2400000.098830
Zinc (Zn)7440-66-60.0005880.2100000.086476
Pure metal layerGold (Au)7440-57-50.0002240.0800000.032943
Nickel (Ni)7440-02-00.0138324.9400002.034255
Palladium (Pd)7440-05-30.0008120.2900000.119420
subTotal0.280000100.00000041.179256
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.500778
Silica fused60676-86-00.20400060.00000030.002030
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.500101
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.250017
PigmentCarbon black1333-86-40.0017000.5000000.250017
PolymerEpoxy resin systemProprietary0.0238007.0000003.500237
Phenolic resinProprietary0.0204006.0000003.000203
subTotal0.340000100.00000050.003383
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000132
Non hazardousProprietary0.0000110.0555000.001632
Tin solderTin (Sn)7440-31-50.01998899.9400002.939611
subTotal0.020000100.0000002.941375
WireImpurityNon hazardousProprietary0.0000010.0100000.000102
Pure metalGold (Au)7440-57-50.00695399.9900001.022614
subTotal0.006954100.0000001.022716
total0.679954100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.