Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC847CQB-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC847CQB-QSOT8015DFN1110D-31.594181 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662972147112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00456076.0000000.286040
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00062810.4700000.039406
Phenolic resinProprietary0.00081213.5300000.050923
subTotal0.006000100.0000000.376369
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000001.881844
subTotal0.030000100.0000001.881844
Lead FrameCopper alloyCopper (Cu)7440-50-80.71880795.58600045.089405
Magnesium (Mg)7439-95-40.0011200.1490000.070286
Nickel (Ni)7440-02-00.0224162.9809001.406137
Silicon (Si)7440-21-30.0048570.6459000.304681
Pure metal layerGold (Au)7440-57-50.0000580.0077000.003632
Nickel (Ni)7440-02-00.0044670.5940000.280199
Palladium (Pd)7440-05-30.0002740.0365000.017218
subTotal0.752000100.00000047.171557
Mould CompoundAdditiveNon hazardousProprietary0.0030540.4100000.191603
FillerSilica -amorphous-7631-86-90.0021600.2900000.135524
Silica fused60676-86-00.64181886.15000040.260014
HardenerPhenolic resinProprietary0.0319604.2900002.004823
PigmentCarbon black1333-86-40.0014160.1900000.088792
PolymerEpoxy resin systemProprietary0.0645928.6700004.051704
subTotal0.745000100.00000046.732460
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000161
Non hazardousProprietary0.0000320.0555000.001984
Tin solderTin (Sn)7440-31-50.05696699.9400003.573358
subTotal0.057000100.0000003.575504
WireImpurityNon hazardousProprietary0.0000000.0100000.000026
Pure metalCopper (Cu)7440-50-80.00418199.9900000.262240
subTotal0.004181100.0000000.262266
total1.594181100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.