Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC857AQC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC857AQCSOT8009DFN1412D-32.419950 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660887147112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01064076.0000000.439679
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00146610.4700000.060571
Phenolic resinProprietary0.00189413.5300000.078274
subTotal0.014000100.0000000.578524
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000001.239695
subTotal0.030000100.0000001.239695
Lead FrameCopper alloyCopper (Cu)7440-50-81.08950193.27920045.021635
Magnesium (Mg)7439-95-40.0016980.1454000.070178
Nickel (Ni)7440-02-00.0339762.9089001.403994
Silicon (Si)7440-21-30.0073620.6303000.304217
Pure metal layerGold (Au)7440-57-50.0004360.0373000.018003
Nickel (Ni)7440-02-00.0335472.8722001.386281
Palladium (Pd)7440-05-30.0014800.1267000.061152
subTotal1.168000100.00000048.265460
Mould CompoundFillerSilica -amorphous-7631-86-90.0887387.9800003.666919
Silica fused60676-86-00.89062380.09200036.803365
PigmentCarbon black1333-86-40.0103190.9280000.426429
PolymerEpoxy resin systemProprietary0.0939648.4500003.882890
Phenolic resinProprietary0.0283562.5500001.171760
subTotal1.112000100.00000045.951363
Post-PlatingImpurityLead (Pb)7439-92-10.0000040.0045000.000154
Non hazardousProprietary0.0000460.0555000.001904
Tin solderTin (Sn)7440-31-50.08295099.9400003.427765
subTotal0.083000100.0000003.429823
WireImpurityNon hazardousProprietary0.0000010.0100000.000054
Pure metalCopper (Cu)7440-50-80.01294999.9900000.535082
subTotal0.012950100.0000000.535135
total2.419950100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.